P73447-B21 256GB Quad Rank X4 Hpe Memory DDR5-6400 EC8 Registered 3DS Smart Memory Kit

Name: P73447-B21 256GB Quad Rank X4 Hpe Memory DDR5-6400 EC8 Registered 3DS Smart Memory Kit
Brand: Heron Technology Co., LTD.
SKU: P73447-B21
Price: 2500 USD
Availability: InStock

Product Summary

P73447-B21 HPE 256GB (1x256GB) Quad Rank x4 DDR5-6400 CAS-60-52-52 EC8 Registered 3DS Smart Memory Kit The P73447-B21 HPE 256GB DDR5-6400 Registered 3DS Smart Memory Kit is an ultra-high-capacity enterprise-grade memory solution engineered for next-generation high-performance data centers, large...

Basic Properties

Place of Origin: China

Brand Name: HPE

Model Number: P73447-B21

Trading Properties

Minimum Order Quantity: 1

Price: 2500 USD

Payment Terms: T/T,Western Union

Tags:

hpe server ssd

hpe hdd

hpe adapter

Product Description

P73447-B21 HPE 256GB (1x256GB) Quad Rank x4 DDR5-6400 CAS-60-52-52 EC8 Registered 3DS Smart Memory Kit

The P73447-B21 HPE 256GB DDR5-6400 Registered 3DS Smart Memory Kit is an ultra-high-capacity enterprise-grade memory solution engineered for next-generation high-performance data centers, large-scale AI/ML deployments, massive virtualization clusters, and memory-intensive mission-critical applications. As HPE's premium Smart Memory solution for high-density workloads, this single-module kit leverages 3D Stacking (3DS) technology to deliver unprecedented memory density, reliability, and operational efficiency.

Built on cutting-edge DDR5 architecture with 3D Stacking technology, this module provides 256GB capacity at 6400 MT/s (PC5-51200), delivering up to 85% higher bandwidth than DDR4 memory. The Quad Rank x4 (4Rx4) configuration with 3DS technology is optimized for extreme high-capacity, high-throughput workloads, making it ideal for large-scale database management, real-time big data analytics, AI/ML model training, multi-tenant virtualization, and high-performance computing applications.

Featuring seamless integration with HPE Smart Memory technology and full compatibility with HPE Active Health System (AHS), this module provides real-time health monitoring and proactive failure alerts. The EC8 dual-error correction (On-Die ECC + Standard ECC) ensures maximum data integrity for mission-critical operations. Operating at 1.1V, it delivers exceptional energy efficiency while maintaining ultra-high 256GB capacity through 3DS technology.

Product Specifications

Part Number (PN)	P73447-B21
Memory Capacity	256GB (1x256GB) Single Module Kit with 3D Stacking (3DS) technology
Memory Type	DDR5 SDRAM Registered 3DS Smart Memory (RDIMM)
Memory Speed	6400 MT/s (PC5-51200); supports 6400 MT/s in 1DPC configuration, 4800 MT/s in 2DPC configuration
Rank & Bit Width	Quad Rank x4 (4Rx4); optimized for high-capacity, high-throughput workloads
CAS Latency	CAS-60-52-52 (CL-TRCD-TRP)
ECC Support	EC8 (On-Die ECC + Standard ECC)
Voltage	1.1V (Low Power Consumption)
Form Factor	288-pin DIMM optimized for 3D Stacking technology
Manufacturer	Hewlett Packard Enterprise (HPE)
UPC/JAN Code	UPC: 0190017710402; JAN: 4549821591596
Weight	0.08 kg (2.82 oz)
Dimensions	8.89 x 19.05 x 2.55 cm

Shipping Information

All P73447-B21 memory modules are packaged in authentic HPE packaging designed to protect 3DS high-density components from physical damage, electrostatic discharge, and environmental factors. We partner with top-tier logistics providers including UPS, DHL, and FedEx for secure, timely worldwide delivery.

Domestic orders (USA): 1-4 business days
International shipments: 4-9 business days (subject to customs clearance)
Tracking number provided upon dispatch
Bulk orders (4+ units): Tailored shipping solutions and preferential pricing
All shipments fully insured against damage, loss, or theft

Frequently Asked Questions

Which HPE servers are compatible with the P73447-B21 memory kit?

The P73447-B21 is designed for HPE Gen12 servers supporting DDR5 RDIMM memory with 3D Stacking technology, including HPE ProLiant DL380 Gen12, DL360 Gen12, DL580 Gen12, ML350 Gen12, ML30 Gen12, and HPE Apollo series servers. Fully compatible with Intel Xeon 6700/6500 series processors. Not compatible with HPE Gen11 or earlier servers.

How does the 256GB Quad Rank x4 (4Rx4) 3DS configuration stand out for enterprise use?

The 256GB Quad Rank x4 configuration with 3DS technology delivers unprecedented memory density (256GB per module) without increasing physical size, drastically reducing DIMM slots required for ultra-high total memory capacity. The Quad Rank design enhances throughput for multi-threaded workloads, while 3DS technology enables higher density via stacked die packaging without sacrificing reliability or energy efficiency.

What is 3DS (3D Stacking) technology, and how does it benefit the P73447-B21?

3D Stacking technology stacks multiple DRAM die vertically, enabling significantly higher memory capacity in the same compact 288-pin DIMM form factor. For the P73447-B21, this technology achieves 256GB capacity—doubling the density of 128GB non-3DS modules without increasing size or power consumption. This maximizes memory density per server, reduces rack space usage, and lowers total cost of ownership.

Can I mix the P73447-B21 with other DDR5 memory modules in my server?

HPE strongly recommends using identical HPE Smart Memory kits (same part number, capacity, speed, rank, and 3DS technology) for optimal performance and compatibility. Mixing with other modules may result in reduced performance, system instability, or loss of HPE Smart Memory-exclusive features and 3DS-related optimizations.

Is professional installation required for the P73447-B21 memory kit?

Installation can be completed by IT personnel with basic server maintenance experience. Follow standard memory upgrade procedures with ESD protection. Before installation, power off the server and disconnect all power sources. Align the module with the DIMM slot, press firmly until retaining clips lock, and verify installation via server's iLO interface or system BIOS.

Product Details

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