Xeon Platinum 8580 Processor with 60 Cores 120 Threads and 300 MB L3 Cache

Name: Xeon Platinum 8580 Processor with 60 Cores 120 Threads and 300 MB L3 Cache
Brand: Heron Technology Co., LTD.
SKU: 8580
Price: 3,000.00 USD
Availability: InStock

Product Summary

Intel Xeon Platinum 8580: 60 cores, 120 threads, 4.0GHz max turbo. Ideal for HPC, AI, virtualization & mission-critical enterprise workloads with advanced security and DDR5 memory support.

Basic Properties

Brand Name: Intel

Model Number: 8580

Trading Properties

Minimum Order Quantity: 10

Price: 2000-4000 USD

Payment Terms: T/T

Tags:

hpe adapter

Product Description

Xeon Platinum 8580 Processor

The Xeon Platinum 8580 processor is a high-end server CPU from the 5th Gen Xeon Scalable Processor family (Emerald Rapids). Engineered for demanding enterprise data centers, high-performance computing, virtualized environments, and mission-critical applications, it delivers exceptional multi-threaded performance with large cache capacity, high-speed interconnects, and advanced security features.

Key Specifications

Basic Parameters

Specification	Details
Processor Generation	5th Gen Xeon Scalable Processors (Emerald Rapids)
Product Line	Xeon Platinum
Model Number	8580
Launch Date	Q4 2023
Market Segment	Server/Enterprise
Lithography	Intel 7 (10nm Enhanced SuperFin)

Core & Thread Configuration

Feature	Specification
Total Cores	60
Total Threads	120 (with Hyper-Threading Technology)
Processor Base Frequency	2.0 GHz
Max Turbo Frequency	4.0 GHz
All-Core Turbo Frequency	2.9 GHz
High-Priority Cores	16 @ 2.2 GHz
Low-Priority Cores	44 @ 1.8 GHz

Cache Memory

Cache Level	Capacity
L1 Cache	80 KB per core (4,800 KB total)
L2 Cache	2 MB per core (120 MB total)
L3 Cache	300 MB (shared across all cores)

Memory Specifications

Memory Feature	Specification
Maximum Memory Size	Up to 4 TB
Memory Type	DDR5-5600 MT/s (1 DPC)
Memory Channels	8
ECC Memory Support	Yes

Interconnect & I/O

Interface	Specification
Ultra Path Interconnect (UPI)	4 UPI links @ 20 GT/s
PCI Express Revision	5.0
PCI Express Lanes	80
Scalability	2S (2-socket configurations)

Power & Thermal

Parameter	Value
TDP (Thermal Design Power)	350 W
Case Temperature	81 °C
DTS Max Temperature	98 °C

Packaging & Physical

Physical Characteristic	Specification
Socket Type	FCLGA4677
Package Size	77.5 mm x 56.5 mm
Package Carrier	E1A

Advanced Technologies

Hyper-Threading Technology: Enables 2 threads per core for maximum parallel processing efficiency
Turbo Boost Technology 2.0: Dynamically increases processor frequency for performance bursts
Speed Shift Technology: Enables rapid frequency and power state transitions
Speed Select Technology: Provides granular control over core frequencies
Deep Learning Boost (DLB): Accelerates AI inference with Advanced Matrix Extensions
Virtualization Technology: Optimizes virtual machine performance and security
Resource Director Technology: Monitors and controls resource allocation
Secure Boot & Advanced Security: Protects against malware and unauthorized modifications
Transactional Synchronization Extensions: Enhances multi-threaded application performance