P43337-B21 HPE 256GB Octal Rank x4 DDR5-4800 EC8 Registered Smart Memory Kit

The P43337-B21 HPE 256GB (1x256GB) Octal Rank x4 DDR5-4800 CAS-46-39-39 EC8 Registered Smart Memory Kit is an enterprise-grade, ultra-high-capacity memory solution purpose-engineered exclusively for HPE ProLiant Gen11 server platforms. Designed to address the most demanding workloads in modern data centers—including large-scale virtualization, in-memory databases, cloud infrastructure, high-performance computing (HPC), and big data analytics—this module delivers an unparalleled combination of massive capacity, reliable performance, and energy efficiency.

Leveraging cutting-edge DDR5 technology and an octal-rank x4 (8Rx4) architecture with 3D Stack (3DS) design, it provides a substantial leap in bandwidth and latency improvements over legacy DDR4 solutions, enabling servers to efficiently scale with multi-core processors and data-intensive applications. The EC8 Registered design, paired with advanced ECC capabilities and HPE SmartMemory technology, ensures exceptional signal integrity, robust data protection, and maximum system uptime.

Operating at a native speed of DDR5-4800 MT/s (PC5-38400) with precise CAS-46-39-39 timings, this memory kit delivers consistent, high-speed data access critical for large-scale transactional databases, virtual machine (VM) density, and real-time analytics. The octal-rank x4 (8Rx4) configuration maximizes memory channel utilization, providing enhanced parallelism and throughput compared to dual-rank, quad-rank, or single-rank modules.

Built to HPE's stringent quality standards, the P43337-B21 incorporates advanced Error Correcting Code (ECC) technology, which actively detects and corrects single-bit memory errors in real time, preventing data corruption and unplanned system crashes. Full integration with the HPE Active Health System (AHS) enables continuous, proactive monitoring of memory health.

This Smart Memory Kit is fully qualified and optimized for HPE ProLiant Gen11 Intel-based servers, including rack, tower, and blade models, as well as Synergy compute modules. The standard 288-pin RDIMM form factor ensures straightforward, hot-swap capable installation.

Designed for modern, power-conscious data centers, the module operates at a low 1.1V supply voltage, significantly reducing power consumption and heat generation compared to DDR4 modules. HPE SmartMemory technology further optimizes power usage dynamically based on workload demands.

• Large-Scale Server Virtualization & Hyper-Converged Infrastructure (HCI): Maximizes VM density and performance for VMware, Hyper-V, and Nutanix environments
• In-Memory Database Management: Enhances throughput and reduces latency for SAP HANA, Oracle Exadata, and other large-scale in-memory database deployments
• Cloud & Edge Computing: Provides reliable, high-capacity memory for public/private cloud nodes and edge server appliances
• Big Data & Business Analytics: Accelerates data processing for BI tools, data warehouses, and real-time analytics platforms
• High-Performance Computing (HPC): Powers scientific simulations, computational research, and AI/ML training workloads
• Mission-Critical Enterprise Servers: A robust, high-reliability choice for scaling memory in mission-critical Gen11 server deployments

• Processing Time: Standard orders ship within 1-2 business days upon payment confirmation. Bulk orders (10+ units) may require 3-5 business days for additional quality inspection and packaging.
• In-Stock Status: Product availability is updated in real-time. Backordered items will be shipped as soon as stock is replenished, with notifications provided to customers.

• Carriers: We utilize DHL, FedEx, and UPS for international shipments, and trusted regional carriers for domestic deliveries
• Estimated Transit Times:
  • North America & Europe: 5-7 business days
  • Asia-Pacific: 4-6 business days
  • Remote Locations: May add 2-3 additional business days
• Tracking: A unique tracking number is sent via email once the order ships, allowing for real-time delivery monitoring

• All memory kits are packaged in anti-static, shock-absorbent materials to prevent Electrostatic Discharge (ESD) and physical damage during transit
• Each unit is sealed in HPE-branded packaging with a genuine warranty label for authenticity verification

• Customs & Duties: The buyer is responsible for all applicable import duties, taxes, and customs fees levied by the destination country
• Documentation: A detailed commercial invoice is included with all international shipments to facilitate smooth customs clearance